Our Assembly Test service covers all aspects from component testing to complete machine testing, and can meet your different testing needs.
Other Service
Our assembly test project includes the following
AOI (automatic optical inspection): Uses image analysis, computer, and automatic control technologies to detect and process PCB defects.
FAI (first article inspection) system: High-precision sorting, pass/fail indication with voice broadcast, serial and parallel equivalent mode, L-RDC simultaneous test, screen capture and data recording functions.
ICT (in-circuit test): Simulates PCB circuit input and output to measure values against standards.
X-RAY inspection equipment: Uses X-ray penetration and density changes to create contrast images and detect internal PCB structure issues without damaging the board.
Three-dimensional solder paste inspection (SPI): Checks solder paste volume, area, height, offset, and shape. Detects defects like missed printing, less/more tin, continuous tin, deviation, poor shape, and board surface contamination.
Plug-in online visual inspection instrument: Uses optical principles and image analysis to detect defects like wrong parts, missing parts, reverse orientation, multiple parts, and offsets in the DIP process.
X-ray Coating Thickness Gauge: Multi-functional testing instrument for comprehensive and accurate detection and analysis of coatings to improve product quality and production efficiency.
High and low-temperature tester: Tests parts and materials under high (-70-150°C) and low temperatures (-70-150°C) and humidity (20%-98%) to assess performance indicators.
