Asinda has embedded a real-time quality monitoring system in each production stage of PCB manufacturing , covering the entire chain from base materials to finished products, achieving "0" defects for each PCB.
1. Inspection of the appearance ,size ,performance of the material
2. Circuit production stage (core conductive layer inspection)
(1) Dry film adhesion testing and dry film appearance testing after dry film lamination.
(2) Post-exposure and development inspection: Line pattern accuracy inspection, AOI and manual re-inspection
(3) Etching integrity inspection: Appearance inspection and adhesion test.
3. Drilling and metallization of holes
(1) After drilling,Hole position and diameter inspection: Measure each hole one by one with a two-dimensional image measuring instrument and conduct random checks on the hole wall quality.
(2) Pre-detection of in-hole conductivity and copper layer thickness after copper plating/electroplating.
4. After the solder mask coating/exposure: Appearance inspection of the solder mask
5.After screensilk : Screensilk quality inspection
6. After CNC Routing : Inspection of external dimensions and edge quality.
7. After surface treatment (such as gold plating, tin spraying) : Inspection of the appearance and thickness of the coating
8. Final inspection of finished products (Comprehensive verification before leaving the factory)
• Full electrical performance inspection: 100% testing with flying probe testing machine/needle bed testing conductivity and insulation
• Final appearance inspection: AOI+ manual re-inspection
• Reliability spot checks.
During the production process, Asinda uses the MES system to manage each process and strictly controls the inspection procedures to acheive 0 defect.
